SEMICONDUCTOR DEVICE HAVING WAFER LEVEL CHIP SCALE PACKAGING SUBSTRATE DECOUPLING

摘要

One aspect of the invention provides a semiconductor device (100) that includes a microchip (110) having an outermost surface. First and second bond pads are located on the microchip and near the outermost surface (135). A first UBM contact is located on the outermost surface and between the first (140) and second (145) bond pads. The first UBM contact (170) is offset from the first bond pad. A second UBM contact (175) is located on the outermost surface and between the first and second bond pads. The second UBM contact is offset from the second bond pad, and a capacitor supported by the microchip is located between the first and second UBM contacts.