发明名称 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition having excellent effects relative to heat resistance such as glass transition temperature and thermal weight reduction temperature, and photosensitivity such as developability, sensitivity and resolution. <P>SOLUTION: The negative photosensitive resin composition includes (A) 100 pts.mass of a polyphenylene ether, (B) 10-40 pts.mass of a crosslinking agent having a CH<SB>2</SB>OR group (wherein R denotes a 1-4C alkyl group) which causes a crosslinking reaction in the presence of an acid catalyst, (C) 2-20 pts.mass of a photoacid generator having a naphthalene nucleus or an anthracene nucleus, and (D) 400-2,500 pts.mass of a solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009115835(A) 申请公布日期 2009.05.28
申请号 JP20070285127 申请日期 2007.11.01
申请人 TOKYO INSTITUTE OF TECHNOLOGY;ASAHI KASEI ELECTRONICS CO LTD 发明人 UEDA MITSURU;MIZOGUCHI KATSUHISA;IKEDA AKIHIKO
分类号 G03F7/038;G03F7/40 主分类号 G03F7/038
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