SUSPENSION SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a suspension substrate suppressing growth of an intermetallic compound layer generated on a contact interface between a connection portion and a gold plating layer and preventing deterioration of the connection portion.

SOLUTION: This suspension base board having a connection region includes: a conductive layer; the gold plating layer formed on a surface of the conductive layer to prevent corrosion of the conductive layer; the connection portion for electrically connecting the conductive layer and the member to be connected through the gold plating layer. The connection portion is made of Au-Sn alloy composed mostly of Au.

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