METHOD FOR MANUFACTURING METAL STRIP WITH THICK-FILM SOLDER LAYER AND METAL STRIP WITH THICK-FILM SOLDER LAYER MANUFACTURED BY THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal strip with a thick-film solder layer in which a solder layer has a thickness dimension of over 50μm, and has small variation in the thickness dimension in a longitudinal direction. SOLUTION: A state where a region 1A of a portion of the metal strip 1 with a primary plated layer is maintained and while the relative movement along a longitudinal direction LD is generated between a molten solder feeding device 15 and the metal strip 1 with the primary plated layer, the molten solder 13 from the molten solder feeding device 15 is placed on the primary plated layer 5 and the thick-film solder layer 9 is formed on the metal strip 1. COPYRIGHT: (C)2009,JPO&INPIT