发明名称 |
Method of manufacturing printed circuit board |
摘要 |
A method of manufacturing a printed circuit board is disclosed. The method may include: stacking an anti-plating layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove, by removing a portion of the anti-plating layer and a portion of the copper clad laminate; stacking a seed layer over a surface of the intaglio groove; forming a plating layer, by plating an inside of the intaglio groove; and removing the anti-plating layer and the copper foil.
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申请公布号 |
US2009136656(A1) |
申请公布日期 |
2009.05.28 |
申请号 |
US20080213700 |
申请日期 |
2008.06.23 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK DONG-JIN;JUNG SEUNG-HYUN;KIM SEUNG-CHUL;CHO SOON-JIN |
分类号 |
H05K3/02 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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