发明名称 |
METAL THERMAL INTERFACE MATERIAL AND THERMAL MODULE AND PACKAGED MICROELECTRONIC COMPONENT CONTAINING THE MATERIAL |
摘要 |
The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material. |
申请公布号 |
US2009135567(A1) |
申请公布日期 |
2009.05.28 |
申请号 |
US20080172171 |
申请日期 |
2008.07.11 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
FANN YUAN-CHANG;CHEN CHUN-MU;WONG CHENG-CHOU;TU CHIH-TSUNG;HWANG JEN-DONG |
分类号 |
H05K7/20;B32B3/02;B32B3/24;F28F7/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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