| 发明名称 |
LED CHIP THERMAL MANAGEMENT AND FABRICATION METHODS |
| 摘要 |
<p>The present invention relates to a method of fabricating a high power light-emitting device using an electrolessly or electrolytically plated metal composite heat dissipation substrate of high thermal conductivity and of thermal expansion coefficient matched with the device.</p> |
| 申请公布号 |
WO2009066099(A1) |
申请公布日期 |
2009.05.28 |
| 申请号 |
WO2008GB51072 |
申请日期 |
2008.11.17 |
| 申请人 |
WANG, WANG NANG |
发明人 |
WANG, WANG NANG |
| 分类号 |
H01L33/00;H01L33/22;H01L33/46;H01L33/50;H01L33/64 |
主分类号 |
H01L33/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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