NONWOVEN POLISHING PADS FOR CHEMICAL MECHANICAL POLISHING
摘要
A polishing article and its use as a polishing article for various substrates, especially for polishing a semiconductor wafer. The article is comprised of a mesh of splittable intermingled fibers and a binder material holding the fibers in the mesh. The fibers and binder material provide the polishing pad with an absorptive property that maintains the slurry chemistry and particles near the surface for effective polishing.
申请公布号
WO2007016498(A3)
申请公布日期
2009.05.28
申请号
WO2006US29770
申请日期
2006.08.01
申请人
RAYTECH COMPOSITES, INC.;VAIDYA, NEHA, P.;PETROSKI, ANGELA, L.;MACEY, JAMES, P.
发明人
VAIDYA, NEHA, P.;PETROSKI, ANGELA, L.;MACEY, JAMES, P.