| 摘要 |
An LED(light emitting diode) with a buried electrode is provided to reduce a fabricating cost and improve capabilities in a high current by fabricating a rear-emission LED having a structure similar to the LED of an ideal structure by a surface-emission LED fabricating method wherein the ideal structure is fabricated by attaching a second substrate and detaching a first substrate. An LED is composed of a substrate(101), a buried electrode(111), a first semiconductor layer(102), a light emitting layer(103) and a second semiconductor layer(104). A region where a first electrode(140) composed of a first bonding pad(131) and a first fine electrode(132) is to be disposed is etched to expose the buried electrode so that a first electrode is disposed. A transparent ohmic contact layer(121) is formed on the second semiconductor layer. A second electrode(150) composed of a second bonding pad(141) and a second fine electrode(142) is connected to the transparent ohmic contact layer. The region for forming an electrode is etched in a manner that a passivation layer is formed prior to formation of a semiconductor layer to prevent the buried electrode from being selectively etched, so that the semiconductor layer is selectively formed. |
