| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a card manufacturing method with which costs can be reduced without complicated additional processes. <P>SOLUTION: The card manufacturing method includes accommodation of an IC module 11 so that its surface may have a slope to the main part surface. An upper side core sheet 15 contacting the IC module 11 from the upper side includes a region Rt1 where a first end 11a of the IC module 11 to be lifted to the upper side is located. An upper side opening 15a is provided to a region excepting a region Rt2 contacting a second end 11b of the IC module 11 to be lowered to the bottom side. A bottom side core sheet 16 contacting the IC module 11 from the bottom side includes a region Rb2 where the second end 11b is located. A bottom side opening 16a is provided to a region excepting a region Rb1 contacting the first end 11a. At least an upper side surface sheet 17, the upper side core sheet 15, the IC module 11, the bottom side core sheet 16, and a bottom side surface sheet 18 are laminated in this order and are heated and pressurized. <P>COPYRIGHT: (C)2009,JPO&INPIT |
