METHOD OF FORMING WIRING PATTERN AND METHOD OF MANUFACTURING WIRING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a wiring pattern which can finely and accurately form a wiring pattern, and to provide a method of manufacturing a wiring substrate using the same. SOLUTION: The method of forming a wiring pattern includes: a step to form an interlayer insulating layer 12; a step to make a via hole 12a in the interlayer insulating layer 12 wherein a wiring pattern 10 of a lower layer is exposed over the inner bottom; a step to form a plating seed layer 18 on the surface of the interlayer insulating layer 12 and the inside of the via hole 12a; a step to cover the surface of the plating seed layer 18 with a resist 30; a step to form a wiring groove 30a in the resist 30 by laser processing; a step to apply electrolytic plating while using the plating seed layer 18 as a plating electric-supply layer and cover the via hole 12a and the wiring groove 30a with a conductor 32; and a step to remove the resist 30 and the plating seed layer 18 and form a wiring pattern 32a on the interlayer insulating layer 12. COPYRIGHT: (C)2009,JPO&INPIT