发明名称 ELECTRONIC COMPONENT, MOUNTING STRUCTURE THEREOF, AND METHOD FOR MOUNTING THE ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic component capable of improving connection reliability with a connecting electrode. <P>SOLUTION: An electronic component includes a quartz crystal piece 11 having a predetermined function; a bump electrode 14 formed on the quartz crystal piece 11; and an adhesive layer 15 holding a conductive contact state between the bump electrode 14 and a connecting electrode 33, 34, where the bump electrode 14 includes a resin core 24 with elastic property and a conductive film 25, 26 provided on a surface of the resin core 24, and the conductive film 25, 26 and the connecting electrode 33, 34 are conductively connected by elastic deformation of the resin core 24. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009118450(A) 申请公布日期 2009.05.28
申请号 JP20080036715 申请日期 2008.02.18
申请人 SEIKO EPSON CORP 发明人 HASHIMOTO NOBUAKI
分类号 H03H9/09;H01L21/60;H03H9/10 主分类号 H03H9/09
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