| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive functional element package having an improved manufacturing yield by providing bonding construction superior in solder wettability and bonding property, in a structure for air-sealing a functional element at a wafer level with solder bonding. SOLUTION: The method of manufacturing functional element package includes: a step of preparing a first Si substrate 5 having a recessed portion 25 formed on the substrate, a metallized portion 22B formed on the surface of the substrate including the recessed portion, and a soldered portion 23 formed on the metallized portion; a step of preparing a second Si substrate 1 having a metallized portion 22A formed on the substrate; a step of making the first Si substrate and the second Si substrate opposing each other; and a step of making the opposed first and second Si substrates close to each other and bonding them to each other. COPYRIGHT: (C)2009,JPO&INPIT
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