| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device that can prevent the mixture of gas between treatment chambers without greatly increasing its cost. SOLUTION: The substrate treatment device includes the plurality of treatment chambers 240 for applying predetermined treatment onto a substrate W, a preheating chamber 230 for preheating the substrate W, a cooling chamber 250 for cooling the substrate W, and a common carrying chamber 220 for carrying the substrate W between the chambers, the treatment chambers 240 being connected via a gate valve 241 to the common carrying chamber 220 in a communicative manner, the preheating chamber 230 and the cooling chamber 250 being connected to the common carrying chamber 220 in a consistently communicative state. Herein, purge gas introducing means 251, 282, 280 and exhaust means 231, 222, 401 are provided for introducing purge gas into the cooling chamber 250 and for passing the purge gas introduced into the cooling chamber 250, through the common carrying chamber 220 and then exhausting it to the outside, respectively. COPYRIGHT: (C)2009,JPO&INPIT
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