发明名称 SPUTTERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a sputtering apparatus of a passage deposition type which improves the efficiency in the use of a target. SOLUTION: Portions of a plurality of magnet traveling trajectories 21, 22 are arranged in the positions just at the rear of first and second targets 11, 12 of a rectangular shape, and magnetron magnet devices 31, 32 of the same diameter as that of the respective magnet traveling trajectories 21, 22 are mounted to the magnetron magnet devices 31, 32. The magnetron magnet devices 31, 32 are made to travel on the magnet traveling trajectories 21, 22. If the erosion regions formed by the magnetron magnet devices 31, 32 are so adapted as not to overlap on each other, the efficiency in the use of the target is improved. The magnets traveling trajectories 21, 22 may be formed to an annular shape such that the magnetron magnet devices 31, 32 may cyclically move. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009114507(A) 申请公布日期 2009.05.28
申请号 JP20070289440 申请日期 2007.11.07
申请人 ULVAC JAPAN LTD 发明人 USHIYAMA FUMIZO;ODAGI HIDEYUKI;KUBO MASASHI;YAMAMOTO KAZUTO;KATAGIRI HIROAKI
分类号 C23C14/35 主分类号 C23C14/35
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