发明名称 ADHESIVE COMPOSITION AND ADHESIVE FILM
摘要 An adhesive composition which is reduced in gas generation upon heating (has low hygroscopicity), has high alkali resistance, has heat resistance of 200° C. or higher, and can be easily removed with a stripping liquid; and an adhesive film made with the adhesive composition. The adhesive composition is prepared using, at least as a major ingredient, an acrylic polymer produced from (a) styrene, (b) a (meth)acrylic ester monomer containing a cyclic skeleton, and (c) an alkyl (meth)acrylate monomer. The adhesive film has an adhesive composition layer formed from this adhesive composition.
申请公布号 US2009137760(A1) 申请公布日期 2009.05.28
申请号 US20060090343 申请日期 2006.10.23
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 MISUMI KOICHI;MIYAGI KEN;MIYANARI ATSUSHI;INAO YOSHIHIRO
分类号 C08F118/02;B24B37/30;C09J7/02;C09J133/06;C09J133/08;H01L21/301;H01L21/304 主分类号 C08F118/02
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