MEMS STRUCTURES, METHODS OF FABRICATING MEMS COMPONENTS ON SEPARATE SUBSTRATES AND ASSEMBLY OF SAME

摘要

Methods of fabricating a microelectromechanical systems (MEMS) device with reduced masking and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device (900) is fabricated by laminating a front substrate (910) and a carrier (950), each of which has components preformed thereon. The front substrate (910) is provided with stationary electrodes formed thereover. A carrier (950) including movable electrodes (1360) formed thereover is attached to the front substrate (910). The carrier (3500) of some embodiments is released after transferring the movable electrodes (3510) to the front substrate (3570). In other embodiments, the carrier (3450) stays over the front substrate (3410), and serves as a backplate for the MEMS device (3400). Features are formed by deposition and patterning, by embossing, or by patterning and etching. In some embodiments in which the MEMS device (5200) serves as an interferometric modulator, the front substrate (5010) is also provided with black masks (5220) to prevent or mitigate bright areas in the actuated state of the MEMS device. Static interferometric modulators (5400) can also be formed by shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.