| 摘要 |
The device has a main polishing arrangement, which has multiple polishing tables (30a,30b), multiple polishing heads (51a,51a',51b,51b') and multiple loading and unloading stations (40a,40a',40b,40b',40c,40c'), which are coupled operationally with a main frame arrangement. Polishing heads are coupled operationally with the main frame arrangement, so that each of the polishing heads is moved between one of the polishing tables and one of the loading and unloading stations. An auxiliary polishing arrangement has an additional polishing table and an additional polishing head, which are coupled operationally with an auxiliary frame arrangement.
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