发明名称 MOISTURE-REACTIVE ADHESIVE COMPOSITION HAVING VERY LOW TEMPERATURE DEPENDENCY OF SHEAR MODULUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide adhesives with minimized temperature dependency of shear modulus. <P>SOLUTION: A moisture-reactive adhesive composites which comprise a specific dialdimine and a polyurethane polymer P1 which is liquid at room temperature and contains isocyanate groups. These compositions are notable for a very low temperature dependency of shear modulus, i.e. after 7 days' storage at room temperature and 50% relative humidity, they feature a ratio of the shear modulus measured at -20°C to the shear modulus measured at 23°C of less than 1.7. These adhesive compositions are suitable particularly as glazing adhesives for means of transport. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009114428(A) 申请公布日期 2009.05.28
申请号 JP20080232640 申请日期 2008.09.10
申请人 SIKA TECHNOLOGY AG 发明人 KONSTANZER MARTIN;BURCKHARDT URS
分类号 C09J175/04;C08G18/10;C08G18/70;C09J175/06;C09J175/08 主分类号 C09J175/04
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