| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device package and a mounting substrate which can efficiently and promptly perform heat dissipation. SOLUTION: The semiconductor device (heating element) package used for a semiconductor device includes: a plurality of circuit substrates containing at least a circuit substrate 3a for loading a heating element 2 and a circuit substrate 3c for loading a thermal ball 4; and first heat conduction layers 6a (6b) which are interposed between the plurality of circuit substrates and constituted of thermally conductive materials, wherein there is formed a thermal via heat dissipation hole 5 penetrating the plurality of circuit substrates and the first heat conduction layers 6a (6b), and the inner wall of the thermal via heat dissipation hole 5 is covered with the thermally conductive material. COPYRIGHT: (C)2009,JPO&INPIT
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