发明名称 Electronic substrate assembly structure for use in vehicle electronic device, has water proof seal inserted in connection section and sealed by connecting screw, where electronic substrate is adhered by water proof seal
摘要 <p>The structure has a ground plate part (2) provided with a heat transfer section. A cut-protection section forms a gap between an opposite side upper surface and two heat transfer models, where the gap is filled with thermal conductive adhesive. A connection section includes a covering part (1) and the ground plate part, and a water proof seal is inserted in the connection section and sealed by a connecting screw (3). An electronic substrate (5) is adhered in a sandwich manner by the water proof seal. The seal and adhesive are selected from a fluid silicon resin material.</p>
申请公布号 DE102008015785(A1) 申请公布日期 2009.05.28
申请号 DE20081015785 申请日期 2008.03.26
申请人 MITSUBISHI ELECTRIC CORP. 发明人 YUHARA, MASAHARU;FUJITA, MASAHIDE;MARUO, KENICHI;HASHIMOTO, KOJI
分类号 H05K7/14;H05K7/20 主分类号 H05K7/14
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