Sub micrometer structures producing method for structuring of e.g. scanning tips, for micro or nano-technology, involves selectively etching layer to be structured, and removing upper masking layer afterwards

摘要

The method involves forming a layer sequence on a topography i.e. substrate (1) with an elevation (1a), for covering the substrate, where the sequence has a lower layer, a layer to be structured e.g. dielectric layer, and an upper masking layer. The layers are selected such that the layer to be structured is selectively etched towards the masking layer. An opening with sub micrometer dimensions is formed in the masking layer using energy beam. The structured layer is selectively etched through the opening for producing a submicrometer structure. The masking layer is removed afterwards.