| 摘要 |
<p>A through hole (28) passes from a surface of an arbitrary plate (24a) to a rear face of an arbitrary plate (24a). A wiring board (29) is received by a wall face of the through hole (28). A third conductive pattern of the wiring board (29) connects a first conductive pattern (26) formed on the surface of the arbitrary plate (24a) and a second conduction pattern (26) formed on the rear face of the arbitrary plate (24a). A plurality of the third conductive patterns can be formed in the wiring board (29) at minute intervals, for example. Thus, a minute wiring structure can be established in the wiring board (29) compared to a case when a plurality of through holes are formed based on a plating processing, for example. Spaces on the surface and the rear face of the printed board (21) can effectively be used. An arbitrary plate (24b) having the second conductive pattern (26) can be differ from the arbitrary plate (24a) having the first conductive pattern.</p> |
