| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a gap of an inner lead from remaining in a package as a space upon mounting a semiconductor element on upper and lower both surfaces of a lead frame around which at least part of the inner lead is extended. <P>SOLUTION: A lead frame 1 has a first outer lead part 3 and a second outer lead part 4 disposed via an element mounting region X with respect to the outer lead part. An inner lead part 2 includes a first inner lead 2A connected with a first outer lead 3A and a second inner lead 2B connected with a second outer lead 4A. At least one of the first and second inner leads 2A, 2B is extended within the element mounting region X. A gap of the inner lead 2B located within the element mounting region X is filled with insulating resin 5. A semiconductor device is constituted by mounting a plurality of semiconductor elements on both upper and lower sides of the lead frame 1. <P>COPYRIGHT: (C)2009,JPO&INPIT |
