CURABLE RESIN COMPOSITION, LIGHT EMITTING DIODE (LED) PACKAGE USING THE SAME, AND ITS PREPARATION

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition being capable of maintaining high brightness of the LED under a high temperature and a high humidity, and being excellent in liquid transfer moldability.

SOLUTION: A curable resin composition comprising a polyol component containing a tri- or more-functional polycaprolactone polyol and/or a component unit originated from the polycaprolactone polyol and a tri- or more-functional aliphatic polyol and/or a tri- or more-functional polyol having a component unit originated from the aliphatic polyol, and a polyisocyanate component containing a di- or tri-functional alicyclic polyisocyanate having an isocyanate group bonded to a secondary carbon atom and/or a di- or tri-functional polyisocyanate having a component unit originated from the alicyclic polyisocyanate, in which the curable resin composition forms a cured material having 65 or more of shore A hardness at 165 degrees C when it is heated at 165 degrees C for 5 minutes.

COPYRIGHT: (C)2009,JPO&INPIT