| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily remove resin burr without damaging a resin body that covers leads, in a semiconductor device configured by performing resin molding on the leads. <P>SOLUTION: In the semiconductor device 10, the lead 11 is covered with metal coating on the outer surface of a metal sheet member, to which a semiconductor chip 12 is attached. A peripheral portion 15 the lead 11 is covered with coating containing diamondoid. The coating is formed by self-assembling, on the lead 11, functional organic molecules constituted of diamondoid having a metal-bonding functional group at one end. <P>COPYRIGHT: (C)2009,JPO&INPIT |
