CONDUCTIVE PARTICULATE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONDUCTIVE CONNECTION STRUCTURAL BODY

摘要

PROBLEM TO BE SOLVED: To provide conductive particulates which are used for conductive connection between fine electrodes, in which fractures of a solder layer and disconnection due to breakage of connection interfaces between the electrodes and the conductive particulates hardly occur even when an impact is applied due to falling or the like, and of which fatigue hardly occurs even when heating and cooling are repeated, and provide an anisotropic conductive material and a conductive connection structural body composed by using the conductive particulates. SOLUTION: The conductive particulates in which the solder layer containing tin is formed on the surface of resin particulates have nickel adhered to the surface of the solder layer, with a nickel content to the sum of metal contained in the solder layer and the nickel adhered to the surface of the solder layer of 0.0001 to 5.0 wt.%. COPYRIGHT: (C)2009,JPO&INPIT