| 摘要 |
A module with embedded components whose height and size can be reduced even when electronic components such as an integrated circuit element and passive elements are densely packaged on a substrate. A module (10) with embedded components comprises a core substrate including a lower surface (11B), an upper surface (11E) facing the lower surface (11B), recessed portions (11D) and a projecting portion (11C) formed in the lower surface (11B), and in-plane conductors (12A), an integrated circuit element (13) mounted on a portion of the upper surface (11E) corresponding to the projecting portion (11C), a first and second passive elements (14A, 14B) mounted on the recessed portions (11D) of the lower surface (11B), a composite resin layer (15) formed on the lower surface (11B) and having the flat surface, and external terminal electrodes (16) formed on the flat surface of the composite resin layer (15) and electrically connected to the in-plane conductors (12A) of the core substrate (11). |
