| 摘要 |
A method of fabricating MMCs having high thermal conductivity coupled with coefficient of thermal expansion (CTE) values which approximates the CTE of ceramics and semi-conductor materials typically used in electronic packaging. The method comprises preparing a formed agglomeration of powder particles (preform); partially sintering the preform; placing the partially sintered preform into a forming chamber; infiltrating the preform with liquid-phase metal; and allowing the liquid-phase metal to solidify and form an MMC around and through the preform. In a preferred embodiment, the preform is constructed from silicon carbide, and the metal matrix is an aluminum-silicon alloy. |
