| 摘要 |
The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer and a die bonding adhesive layer being sequentially laminated on a supporting substrate, wherein the pressure-sensitive adhesive layer has a thickness of 10 µm to 80 µm, and has a storage elastic modulus at 23 °C of 1 x 10 4 to 1 x 10 10 Pa. |
