发明名称 |
CLEANING A COMPONENT OF A PROCESS CHAMBER |
摘要 |
<p>Process deposits formed on a component of a process chamber are cleaned. In the cleaning method, gas holes in the component are mechanically pinned to clean the process deposits therein. A ceramic portion of the component is then exposed to an acidic solution, such as a solution of hydrofluoric acid and nitric acid. Mechanical pinning of the gas holes may be repeated after the acid cleaning step. The component is then plasma stabilized in a plasma zone by introducing a non-reactive gas into the plasma zone and forming a plasma of the non-reactive gas in the plasma zone. In one version, the component comprises an electrostatic chuck comprising a ceramic covering an electrode and having the gas holes therein.</p> |
申请公布号 |
EP1635962(B1) |
申请公布日期 |
2009.05.27 |
申请号 |
EP20040750128 |
申请日期 |
2004.04.14 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BHATNAGAR, ASHISH;KUNZE, CHARLES, S. |
分类号 |
B08B7/04;B08B7/00;B08B9/00;C23C16/44 |
主分类号 |
B08B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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