| 发明名称 |
Interconnection element and method of fabrication thereof |
| 摘要 |
An electrical interconnection element (720, 730) comprises: a conductive interconnection component (730), including a connection region; and a conductive cantilever structure (720) formed by depositing spring material (712) in an opening of a masking layer (710) on a sacrificial substrate (702), wherein the conductive cantilever structure (720) is mounted to the connection region of the interconnection component (730). |
| 申请公布号 |
EP2063466(A2) |
申请公布日期 |
2009.05.27 |
| 申请号 |
EP20090000368 |
申请日期 |
1996.05.24 |
| 申请人 |
FORMFACTOR, INC. |
发明人 |
KHANDROS, IGOR Y.;ELDRIDGE, BENJAMIN N.;MATHIEU, GAETAN L. |
| 分类号 |
H01L23/32;H01L23/48;B23K20/00;B23K31/02;C23C18/16;C25D5/08;C25D5/22;C25D7/12;C25D21/02;G01R1/067;G01R1/073;G01R3/00;G01R31/28;H01L21/00;H01L21/48;H01L21/56;H01L21/60;H01L21/603;H01L21/66;H01L21/68;H01L23/485;H01L23/49;H01L23/498;H01L23/66;H01L25/065;H01L25/16;H05K1/14;H05K3/20;H05K3/32;H05K3/34;H05K3/36;H05K3/40 |
主分类号 |
H01L23/32 |
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