| 摘要 |
A backlight device (3) is provided with a substrate (9) whereupon a plurality of light emitting diodes (10) are arranged, and a lower side chassis (heat dissipating unit) (6) where heat generated by the light emitting diodes (10) is transferred from the substrate (9) and dissipated to the outside. An amount of heat generated by each light emitting diode (10) is measured in advance, and in accordance with the measurement results of the amounts of generated heat, an arrangement position on the substrate (9) is determined and corresponding light emitting diodes (10) are arranged.
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