发明名称 |
PRODUCTION METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD |
摘要 |
Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 mum or below. |
申请公布号 |
KR20090053725(A) |
申请公布日期 |
2009.05.27 |
申请号 |
KR20080116259 |
申请日期 |
2008.11.21 |
申请人 |
AJINOMOTO CO., INC.;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
OHASHI SEIICHIRO;HAYASHI EIICHI;NAKAMURA SHIGEO;YAZAWA TAKAAKI;NAKAMURA JUNICHI |
分类号 |
H05K3/40;B23K26/00;H05K3/06 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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