| 摘要 |
A method of manufacturing semiconductor devices includes: preparing a semiconductor substrate over which a laminated structure including an insulating layer is formed; forming over the insulating layer a resist mask including a first opening and a second opening which is greater in width than the first opening; first etching using the resist mask to form a hole which corresponds to the first opening and penetrates the insulating layer and to form a first trench which corresponds to the second opening and is shallower than the hole; forming a deposition film so as to fill the hole; second etching to etch back the deposition film so that the insulating layer is exposed in the first trench and that the deposition film remains in the hole; and third etching using the resist mask and the remaining deposition film for masking to remove the insulating layer part exposed in the first trench so as to form a second trench penetrating the insulating layer.
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