发明名称 Substrate-enhanced electroless deposition (SEED) of metal nanoparticles on carbon nanotubes
摘要 An electroless deposition method of depositing metal nanoparticles onto conductive substrates such as carbon nanotubes is provided. The carbon nanotubes are provided on a support comprising a metal substrate and then immersed in an aqueous solution containing metal ions. The metal substrate metal has a redox potential which is lower than that of the metal ions in solution such that the metal ions are readily reduced into metal nanoparticles on the carbon nanotubes.
申请公布号 US7538062(B1) 申请公布日期 2009.05.26
申请号 US20060522545 申请日期 2006.09.11
申请人 UNIVERSITY OF DAYTON 发明人 DAI LIMING;QU LIANGTI
分类号 B01J21/18 主分类号 B01J21/18
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