| 发明名称 |
Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device |
| 摘要 |
A heat sink includes a base portion formed of insulating diamond, and a plurality of pressure contacting members formed of the insulating diamond and arranged on the base portion
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| 申请公布号 |
US7538423(B2) |
申请公布日期 |
2009.05.26 |
| 申请号 |
US20060534355 |
申请日期 |
2006.09.22 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
ONO TOMIO;SAKAI TADASHI;SAKUMA NAOSHI;YOSHIDA HIROAKI;SUZUKI MARIKO |
| 分类号 |
H01L23/10;H01L23/34 |
主分类号 |
H01L23/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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