发明名称 Heat-dissipating silicone grease composition
摘要 A heat dissipating silicone grease composition comprising: (A) 3% to 30% by weight of an organo polysiloxane represented by the general formula, R1aSiO(4-a)/2(R1 is one or two or more groups selected from a group of saturated or unsaturated monovalent hydrocarbon groups containing one to eighteen carbon atoms, and a is a positive number defined by 1.8<=a<=2.2) having a dynamic viscosity at 25° C. of 50 mm2/s to 500,000 mm2/s; (B) 60% to 96.9% by weight of a thermally conductive filler having a thermal conductivity of at least 10 W/(m.K); and (C) 0.1% to 10% by weight of a solvent that disperses or dissolves component (A).
申请公布号 US7538075(B2) 申请公布日期 2009.05.26
申请号 US20040996418 申请日期 2004.11.26
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 YAMADA KUNIHIRO;TETSUKA HIROAKI
分类号 C10M169/04;C08K3/00;C08K3/08;C08K3/22;C08L83/04;C08L83/06;C10M105/76;C10M107/50;C10M125/02;C10M125/04;C10M125/10;C10M125/20;C10M125/26;C10M127/00;C10M129/06;C10M129/24;C10M169/02;C10N10/02;C10N10/06;C10N10/16;C10N20/02;C10N30/00;C10N40/00;C10N50/10;C10N70/00 主分类号 C10M169/04
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