发明名称 |
Method for improved high current component interconnections |
摘要 |
A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder interconnection between the component and the conductive region of the printed circuit board.
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申请公布号 |
US7538440(B2) |
申请公布日期 |
2009.05.26 |
申请号 |
US20030427681 |
申请日期 |
2003.04.30 |
申请人 |
INTEL CORPORATION |
发明人 |
AMIR DUDI I.;SEARLS DAMION T. |
分类号 |
H01L23/48;H05K1/02;H05K3/34 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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