发明名称 |
Copper interconnection with conductive polymer layer and method of forming the same |
摘要 |
A conductive polymer between two metallic layers acts a glue layer, a barrier layer or an activation seed layer. The conductive polymer layer is employed to encapsulate a copper interconnection structure to prevent copper diffusion into any overlying layers and improve adhesive characteristics between the copper and any overlying layers.
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申请公布号 |
US7538434(B2) |
申请公布日期 |
2009.05.26 |
申请号 |
US20050075072 |
申请日期 |
2005.03.08 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SHIH CHIEN-HSUEH;TSAI MINGHSING;SU HUNG-WEN;SHUE SHAU-LIN |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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