发明名称 |
Integrated circuit micro-cooler having multi-layers of tubes of a CNT array |
摘要 |
Heat sink structures employing multi-layers of carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In one embodiment, the nanotubes are cut to essentially the same length over the surface of the structure. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
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申请公布号 |
US7538422(B2) |
申请公布日期 |
2009.05.26 |
申请号 |
US20060532892 |
申请日期 |
2006.09.18 |
申请人 |
NANOCONDUCTION INC. |
发明人 |
DANGELO CARLOS;OLSON DARIN |
分类号 |
H01L23/34;H01L21/00;H05K7/20 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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