发明名称 Capacitorless DRAM on bulk silicon
摘要 A method of forming capacitorless DRAM over localized silicon-on-insulator comprises the following steps: A silicon substrate is provided, and an array of silicon studs is defined within the silicon substrate. An insulator layer is defined atop at least a portion of the silicon substrate, and between the silicon studs. A silicon-over-insulator layer is defined surrounding the silicon studs atop the insulator layer, and a capacitorless DRAM is formed within and above the silicon-over-insulator layer.
申请公布号 US7538389(B2) 申请公布日期 2009.05.26
申请号 US20050148853 申请日期 2005.06.08
申请人 MICRON TECHNOLOGY, INC. 发明人 MATHEW SURAJ;TRIVEDI JIGISH D.
分类号 H01L29/06 主分类号 H01L29/06
代理机构 代理人
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