| 摘要 |
In a method of aligning a wafer and a method of manufacturing a flip chip, a wafer on which a first alignment mark is formed and a template formed of an opaque material is prepared. The template has a through-hole formed at a position corresponding to that of the first alignment mark and a second alignment mark formed at a position spaced apart from the center of the through-hole by a first distance. The wafer and the template are disposed to be adjacent to each other, and a second distance between the first alignment mark observed through the through-hole and the second alignment mark is measured. After comparing the second distance with the first distance, and when the second distance is different from the first distance, at least one of the wafer and the template is moved to allow the second distance to be equal to the first distance. |
