发明名称 Thin capacitor, laminated structure and methods of manufacturing the same
摘要 <p>Disclosed are an embedded capacitor and a printed circuit board including the same that can minimize the oxidization of a metal layer. A thin-film capacitor can include a first metal electrode film; a barrier layer, formed on the first metal electrode film to include a conductive oxide; a dielectric film, formed on the barrier layer; and a second metal electrode film, formed on the dielectric film. With the present invention, the outstanding characteristic of a ferroelectric thin film can be provided by minimizing the oxidization of a copper film in the heat treatment after forming the ferroelectric thin film on the copper film.</p>
申请公布号 KR100898974(B1) 申请公布日期 2009.05.25
申请号 KR20070059482 申请日期 2007.06.18
申请人 发明人
分类号 H01G4/33;H01G4/30 主分类号 H01G4/33
代理机构 代理人
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