SPUTTERING APPARATUS AND SPUTTERING FILM FORMING METHOD

摘要

Provided is a sputtering apparatus which suppresses entry of thermal electrons into a work and does not cause problems such as work deformation due to heat, even at the time of forming a film on materials, such as plastic, having a low heat resistance. The apparatus is provided with a target and a carousel-type work holder arranged to face the target with a rotating shaft, in a vacuum chamber. The carousel-type work holder has a work holder supporting section and a plurality of work holding sections. The work holding section is arranged at the outer circumfernce of the work holder supporting section. The carousel-type work holder and/or the work holding section is rotatably arranged by a shaft arranged within a surface vertical to a surface connecting the target and the rotating shaft of the carousel-type work holder. Inside the carousel-type work holder, a thermal electron capturing member is arranged.