发明名称 |
PROCESS FOR FORMING THIN FILM ENCAPSULATION LAYERS |
摘要 |
A process is disclosed for making a thin film encapsulation package for an OLED device by depositing a thin film material on an OLED device to be encapsulated, comprising simultaneously directing a series of gas flows along substantially parallel elongated output openings, wherein the series of gas flows comprises, in order, at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, optionally repeated a plurality of times, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material to form an encapsulating thin film, wherein the first reactive gaseous material is a volatile organo-metal precursor compound. The process is carried out substantially at or above atmospheric pressure, and the temperature of the substrate during deposition is under 250°C. |
申请公布号 |
WO2009042052(A3) |
申请公布日期 |
2009.05.22 |
申请号 |
WO2008US10804 |
申请日期 |
2008.09.17 |
申请人 |
EASTMAN KODAK COMPANY;FEDOROVSKAYA, ELENA A.;BOROSON, MICHAEL LOUIS;LEVY, DAVID HOWARD;AGOSTINELLI, JOHN ALPHONSE |
发明人 |
FEDOROVSKAYA, ELENA A.;BOROSON, MICHAEL LOUIS;LEVY, DAVID HOWARD;AGOSTINELLI, JOHN ALPHONSE |
分类号 |
C23C16/40;C23C16/455;H01L51/52 |
主分类号 |
C23C16/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|