发明名称 IMPROVED HOUSING AND MANUFACTURE THEREOF
摘要 <p>An electronic device comprising a first component in sealing engagement with a second component of said device, wherein said sealing engagement includes contact between a discontinuous portion of the first component and a continuous surface of the second component, said discontinuous portion being of a more rigid material than the surface of the second component.</p>
申请公布号 WO2009064253(A2) 申请公布日期 2009.05.22
申请号 WO2007SG00387 申请日期 2007.11.13
申请人 OLYMPUS TECHNOLOGIES SINGAPORE PTE LTD;TAN, TECK BOON, FREDERICK;THAN, CHO CHO;CHIN, YEN, JASON 发明人 TAN, TECK BOON, FREDERICK;THAN, CHO CHO;CHIN, YEN, JASON
分类号 H05K5/00 主分类号 H05K5/00
代理机构 代理人
主权项
地址