发明名称 |
ELECTROLESS/ELECTROLYTIC SEED LAYER PROCESS |
摘要 |
<p>An electroless metallization catalyst layer can be formed in a RFID antenna pattern. A first metallic layer can be deposited over top of the electroless metallization catalyst layer. An electrical short layer connecting regions of the metallic layer can be formed. A portion of electrical short layer can be covered with a non-conductive layer. The first metallic layer can be electroplated with a second metallic layer.</p> |
申请公布号 |
WO2009064598(A1) |
申请公布日期 |
2009.05.22 |
申请号 |
WO2008US81013 |
申请日期 |
2008.10.23 |
申请人 |
RCD TECHNOLOGY INC.;OBERLE, ROBERT, R. |
发明人 |
OBERLE, ROBERT, R. |
分类号 |
C25D5/00 |
主分类号 |
C25D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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