发明名称 THERMALLY CONDUCTIVE RESIN COMPOSITIONS
摘要 <p>Thermally conductive polymer resin compositions comprising polymer, spherical or granular shape thermally conductive filler, and platy thermally conductive filler, and optionally a polymeric toughening agent. The compositions are particularly useful for metal/polymer hybrid parts.</p>
申请公布号 WO2009064883(A1) 申请公布日期 2009.05.22
申请号 WO2008US83401 申请日期 2008.11.13
申请人 E. I. DU PONT DE NEMOURS AND COMPANY;SAGA, YUJI 发明人 SAGA, YUJI
分类号 C08K3/00;C08K7/00 主分类号 C08K3/00
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