<p>An adhesive tape for processing a semiconductor wafer is provided with a base material sheet (11), and an adhesive layer (12) arranged on the base material sheet (11). The base material sheet (11) does not have a yield point on a stress-elongation line up to an elongation rate of 30%, and the base material sheet has a fracture strength of 10N/10mm or more and an elongation rate of 200% or more.</p>
申请公布号
WO2009063793(A1)
申请公布日期
2009.05.22
申请号
WO2008JP70211
申请日期
2008.11.06
申请人
THE FURUKAWA ELECTRIC CO., LTD.;OKAWARA, YOSUKE;MARUYAMA, HIROMITSU;MORISHIMA, YASUMASA;ISHIWATA, SHINICHI
